What's New Page

April.1st,2008
  APPSIDE moved Head Office.

Oct.2nd,2007
  We introduce a product with a booth of　ACRODEA　Corporation in CEATEC JAPAN 2007.

Oct.1st,2007
  We release a module (FP101) which implemented a thin sensor on a flexible Print circuit board(FPC).
Oct.1st, 2007
  We release thin sensor SP201/SP202/SP203.

Oct. 1st ,2007
  We have completed renewal of its company Home Page.